The extruded aluminum heat sink is designed for efficient thermal dissipation in power electronic applications, suitable for audio amplifiers and general-purpose projects.
Mechanical Specifications:
Length: 200 mm
Height: 64 mm
Fin length: 13 mm
Base thickness: 3 mm
Weight: 150 grams
Construction:
Extruded aluminum body for efficient heat transfer
Multiple fins to increase surface area for cooling
Designed for mounting power devices with proper contact
Configuration Notes:
Provides passive cooling without the need for active airflow
Suitable for mounting transistors, MOSFETs, and regulators
Thermal performance depends on airflow and mounting quality
Intended Use:
Audio power amplifier cooling
Power transistor and MOSFET heat dissipation
Voltage regulator cooling
Electronic hobby and DIY projects
