TO-220 / TO-126 size silicone thermal pad designed for effective heat transfer and electrical insulation in power semiconductor applications. This thermal pad is suitable for use with transistors and ICs, helping to improve heat dissipation between the device and heat sink. It provides reliable thermal conductivity while maintaining electrical isolation, ensuring safe and efficient operation in high-power circuits.
Configuration:
Thermal pad for TO-220 and TO-126 packages
Suitable for transistors and ICs
Electrical Characteristics:
Provides thermal conduction with electrical insulation
Suitable for general heat dissipation applications
Package:
Single silicone thermal pad
Construction:
Flexible silicone material
Designed for consistent surface contact
Configuration Notes:
Improves heat transfer to heat sink
Provides insulation between device and mounting surface
Intended Use:
Transistor mounting
IC heat dissipation
Heat sink interface applications
Power electronics and DIY projects
